Kupros Launches Cu29 V2 for Desktop Embedded Electronics

Kupros has released Cu29 V2, the second generation of its all-metal conductive filament for standard FFF and FDM 3D printers. The company also announced a patent-pending process for embedding functional electronics directly into polymer parts without post-processing, wiring, or circuit boards.

What changed in V2

The original Cu29 filament already claimed conductivity up to a million times better than plastic-based conductive filaments. V2 refines extrusion consistency and surface finish, which matters when you are printing fine traces or antenna geometries on a desktop machine. Kupros says the new version prints reliably on both high-end industrial systems and the cheapest consumer FDM printers the company could find.

Embedded electronics from a filament spool

The process Kupros is pitching is simple in concept: print a structural part with Cu29 loaded channels, then finish the object as a single piece. The resulting traces can carry enough current for sensors, antennas, and simple power delivery. No solder, no breadboarding, no secondary tooling.

That removes one of the bigger obstacles to distributed electronics manufacturing. If a designer in a small workshop can print a working antenna or sensor housing in one job, the supply chain shrinks dramatically.

Who this is for

Kupros is selling Cu29 by the spool, not turning itself into a printer OEM. The target buyer is an engineer or R&D team that already owns an FDM machine and needs to prototype conductive features without sending parts out for PCB fabrication. Defense, aerospace, and IoT hardware are the obvious early markets.

Caveats

Conductive FDM traces are not going to replace a copper-clad board for high-density digital logic anytime soon. The resolution is limited by nozzle size, and current carrying capacity depends on layer adhesion. But for certain classes of sensors, connectors, and antennas, the trade-off makes sense.